The 4th International Workshop on Architecture-Aware Simulation and Computing
CALL FOR PAPERS & PARTICIPATION
25 - 29 January 2021
Barcelona, Spain (Virtual/Online event)
Paper Submission Deadline: 25 September 2020
The 18th International Conference on High Performance Computing & Simulation (HPCS 2020)
http://hpcs2020.cisedu.info/ or http://conf.cisedu.info/rp/hpcs20
As part of
Submissions could be for full papers, short papers, poster papers, or posters
To keep pace with the performance increase predicted by Moore's Law, homogeneous/ heterogeneous processor aggregates have been extensively adopted both at the High Performance Computing (HPC) and at the embedded system domains. However, such steady increase (often attained by simply scaling the number of computing cores within a chip) has been threatened by several architectural and technological constraints: limited parallelization opportunities (either at data, task, or even at instruction level); reduced memory throughput and complex cache hierarchies; limited communication bandwidth; thermal, power and energy constraints, etc.
On the other hand, the prevailing heterogeneous computing architectures, often integrating different types of coprocessors and accelerator components, including x86 and ARM CPUs, GPUs, FPGAs, Intel Xeon Phi, has introduced complex challenges to efficiently program and implement HPC applications.
On the embedded domain, different compromises to cope with strict energy efficiency requirements have been demanded. Despite the several different approaches that have been considered either at the processor architecture level (e.g., ARM big.LITTLE clusters) or at the coprocessor/accelerator level (e.g., mobile GPUs, reconfigurable SoCs, etc.), complex challenges are still posed in order to attain the ever increasing performance levels that have also been claimed in this specific domain.
Therefore, it is widely recognized that next generation HPC and embedded systems can only benefit from the hardware’s full potential if both processor and architecture features are taken into account at all development stages - from the early algorithmic design to the final implementation stage.
The AASC workshop strives to address all aspects related to these issues, including, but not limited to:
Hardware-aware compute/memory-intensive simulations of real-world problems in computational science and engineering domains (e.g., applications in electrical, mechanical, physics, geological, biological, or medical engineering).
Architecture-aware approaches for large-scale parallel computing, including scheduling, load-balancing and scalability studies.
Architecture-aware parallelization on HPC platforms, including multi-/many-core architectures comprising coprocessor/accelerator components (e.g., Intel Xeon Phi, GPUs, FPGAs, etc.).
Architecture-aware approaches for energy-efficient implementations and auto-tuning of HPC or embedded applications (e.g., ARM big.LITTLE, mobile GPUs, reconfigurable SoCs, etc.).
Architecture-aware algorithms and solutions.
Programming models and tool support for parallel heterogeneous platforms (e.g., CUDA, OpenCL, OpenACC, PGAS, OmpSS, etc.).
Software engineering, code optimization, and code generation strategies for parallel systems with multi-/many-core processors.
Performance and memory optimization tools and techniques (including cache optimization, data reuse, data streaming, etc.) for parallel systems with multi-core processors.
SCOPE AND OBJECTIVES
You are invited to submit original and unpublished research works on above and other topics related to architecture-aware modeling & simulation, algorithms and computing. Submitted papers must not have been published or simultaneously submitted elsewhere until it appears in HPCS proceedings, in the case of acceptance, or notified otherwise. Submission can be for
- Regular papers, please submit a PDF copy of your full manuscript, not to exceed 8 double-column formatted pages per template, and include up to 6 keywords and an abstract of no more than 400 words. Additional pages will be charged additional fee. Submission should include a cover page with authors' names, affiliation addresses, fax numbers, phone numbers, and all authors email addresses. Please, indicate clearly the corresponding author(s) although all authors are equally responsible for the manuscript.
- Short papers (up to 4 pages), please submit a PDF copy of your full manuscript, not to exceed 4 double-column formatted pages per template, and include up to 6 keywords and an abstract of no more than 400 words. Additional pages will be charged additional fee. Submission should include a cover page with authors' names, affiliation addresses, fax numbers, phone numbers, and all authors email addresses. Please, indicate clearly the corresponding author(s) although all authors are equally responsible for the manuscript.
- Poster papers and Posters (please refer to http://hpcs2020.cisedu.info/1-call-for-papers-and-participation/call-for-posters for posters submission details) will also be considered.
Please specify the type of submission you have. Please include page numbers on all preliminary submissions to make it easier for reviewers to provide helpful comments.
Submit a PDF copy of your full manuscript to the Workshop's paper submission site at xxx. Acknowledgement will be sent within 48 hours of submission.
Only PDF files will be accepted, uploaded to the submission link above. Each paper will receive a minimum of three reviews. Papers will be selected based on their originality, relevance, significance, technical clarity and soundness, presentation, language, and references. Submission implies the willingness of at least one of the authors to register and present the paper, if accepted. At least one of the authors of each accepted paper will have to register and attend (virtually) the HPCS 2020 conference to present the paper at the Symposium as scheduled. By submitting the paper to the HPCS conference, all authors agree to abide by all HPCS conference paper submission, publication and presentation policies as well as following ethical and professional codes of conduct, including those of the professional co-sponsoring organizations. For more information, please refer to the Authors Info and Registration Info pages.
Accepted papers will be published in the Conference proceedings. Instructions for final manuscript format and requirements will be posted on the HPCS 2020 Conference web site. It is our intent to have the proceedings formally published in hard and soft copies and be available at the time of the conference. The proceedings is projected to be included in the IEEE or ACM Digital Library and indexed in all major indexing services accordingly.
Plans are underway to have the best papers, in extended version, selected for possible publication in a reputable journal as special issue. Detailed information will soon be announced and will be made available on the conference website.
If you have any questions about paper submission or the Workshop, please contact the Workshop's organizers.
Paper Submissions: ------------------------------------------- 25 September 2020
Acceptance Notification: -------------------------------------- 09 October 2020
Camera Ready Papers and Registration Due by: ----------- 16 October 2020
Conference Dates: --------------------------------------------- 25 - 29 January 2021
International Program Committee*:
All submitted papers will be rigorously reviewed by the Workshop's technical program committee members following similar criteria used in HPCS 2020 and will be published as part of the HPCS 2020 Proceedings.
(* Committee formation is pending and will be finalized shortly.)
For information or questions about Conference's paper submission, tutorials, posters, workshops, special sessions, exhibits, demos, panels and forums organization, doctoral colloquium, and any other information about the conference location, registration, paper formatting, etc., please consult the Conference’s web site at URL: http://hpcs2020.cisedu.info/ or http://conf.cisedu.info/rp/hpcs20 or contact one of the Conference's organizers.
INSTRUCTIONS FOR PAPER SUBMISSIONS